Surface Mount Technology Manufacture
Our automated surface mount production system consistently delivers top quality assemblies for a diverse range of customers and technologies.
With our heavy emphasis on Statistical Process Control (SPC) we systematically eliminate sources of potential quality issues and continually analyse our systems to ensure that our customers receive first class assemblies – but don’t take our word for it, contact us for a factory tour!
Our in-line SMT manufacturing lines consist of:
- Ekra In-Line Fully Automatic Screen Printer – With repeatability performance of ± 12,5µm @ 6 Sigma the X4 offers the highest level of precision available;
- Samsung Pick & Place – The latest generation of SMT placement equipment. These machines are 100% optical for the placement of fine pitch QFP’s, BGA’s, CSP and other new generation packaging technologies;
- Real Time SPC – The best equipment is only as good as the best operators, and the best operators need real-time feedback. Combining SPC with experience enables potential problems to be corrected immediately.
Click here to contact one of our Production Consultants.
Through-Hole Manufacturing
For our many customers that design through-hole or mixed technology circuits, we wave solder using a dual pot Seho machine with selective soldering equipment to be added shortly, supporting the drive to lead free manufacturing.
For small Through-hole runs see the section on our Prototyping Services